- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 7/10 - Plug-in assemblages of components
Patent holdings for IPC class H05K 7/10
Total number of patents in this class: 977
10-year publication summary
100
|
127
|
75
|
71
|
77
|
42
|
40
|
36
|
28
|
9
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Intel Corporation | 45621 |
45 |
Hewlett Packard Enterprise Development LP | 10702 |
24 |
Foxconn Interconnect Technology Limited | 1034 |
23 |
Samsung Electronics Co., Ltd. | 131630 |
21 |
Hon Hai Precision Industry Co., Ltd. | 4157 |
18 |
Dell Products L.P. | 11144 |
17 |
Shinko Electric Industries Co., Ltd. | 1186 |
16 |
Lotes Co., Ltd. | 346 |
15 |
TE Connectivity Solutions GmbH | 2580 |
15 |
Murata Manufacturing Co., Ltd. | 22355 |
13 |
Apple Inc. | 50209 |
12 |
International Business Machines Corporation | 60644 |
12 |
Huawei Technologies Co., Ltd. | 100781 |
12 |
Cisco Technology, Inc. | 18858 |
10 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
10 |
Samsung Display Co., Ltd. | 30585 |
8 |
Hewlett-Packard Development Company, L.P. | 28538 |
8 |
Infineon Technologies AG | 8189 |
8 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
8 |
Fujitsu Limited | 19265 |
7 |
Other owners | 675 |